Evaluation of low temperature, cofired ceramic multilayer packaging material at microwave frequencies has revealed a lower dielectric constant than the standard measurement at 1 MHz. Examination of resonance comparisons in both the authors' and in previously published work suggest similar conclusions. Measurements using various resonators produced results in agreement with the derivations from other indirect methods. Finally, time-domain network measurements on microstrip structures designed with the 1-MHz dielectric constant and on revised structures using the newly measured dielectric constant are in agreement with the newly measured values. A functional three-dimensional test structure will be described.
