THERMOVISCOELASTIC ANALYSIS OF RESIDUAL-STRESSES AND WARPAGE IN COMPOSITE LAMINATES

被引：57

作者：

WANG, TM ^{[1
]}

DANIEL, IM ^{[1
]}

GOTRO, JT ^{[1
]}

机构：

[1] IBM CORP,ENDICOTT,NY 13760

来源：

JOURNAL OF COMPOSITE MATERIALS | 1992年 / 26卷 / 06期

关键词：

RESIDUAL STRESSES; WARPAGE; LAMINATION THEORY; VISCOELASTICITY; MOIRE METHOD; CIRCUIT BOARDS;

D O I：

10.1177/002199839202600606

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

Linear thermoviscoelastic lamination theory was used to determine residual stresses and warpage in multidirectional woven-glass/epoxy laminates. The single "unidirectional" layer of the material was characterized by means of an accelerated procedure. The material was assumed to be thermorheologically simple and the time-temperature superposition principle (TTSP) was used to obtain "master curves" for the viscoelastic properties. A numerical procedure was developed for determination of residual stresses and warpage, taking into consideration the irreversible polymerization shrinkage and boundary conditions during curing. Warpage was measured experimentally for [0(6)/90(6)] and [0(11)/30] laminates using the projection moire method and results were in good, agreement with the analytical prediction.

引用

页码：883 / 899

页数：17

共 8 条

[1]

DANIEL IM, 1990, J COMPOS TECH RES, V12, P172

[2]

DANIEL IM, 1989, 1989 P ANTEC C SOC P, V35, P632

[3]

DANIEL IM, 1990, ASME, V112, P11, DOI DOI 10.1115/1.2904332

[4]

Ferry J. D., 1961, VISCOELASTIC PROPERT