DISSOLUTION OF SOLID COPPER INTO MOLTEN TIN UNDER STATIC CONDITIONS

被引：14

作者：

SHOJI, Y ^{[1
]}

UCHIDA, S ^{[1
]}

ARIGA, T ^{[1
]}

机构：

[1] TOKAI UNIV,FAC ENGN,DEPT MET ENGN,TOKYO 151,JAPAN

来源：

TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS | 1980年 / 21卷 / 06期

关键词：

BRAZING - Filler Metals - SOLDERS;

D O I：

10.2320/matertrans1960.21.383

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The investigation was undertaken to determine the effect of natural convection on the dissolution of solid copper into molten tin using two kinds of reaction couple methods: the copper lower position and the copper upper position. The effect of copper concentration in molten tin on the dissolution was also studied.

引用

页码：383 / 389

页数：7

共 12 条

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[3]

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[5]

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[6]

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[8]

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[9]

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[10]

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