PERFORMANCE OF THIN FILM-CHIP RESISTORS

被引:6
作者
BOS, L
机构
[1] International Resistive Company, Corpus Christi
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A | 1994年 / 17卷 / 03期
关键词
D O I
10.1109/95.311744
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Increased use of thin-film surface mount chip resistors in military and high-performance industrial equipment has led to an increased awareness of potential failure modes in harsh environments. In this work, we have studied the behavior of chip resistors fabricated from tantalum nitride and nichrome metal films under biased humidity and have measured widely different results attributable to the metal film and protective system. The effects of electrostatic discharge (ESD) and high-temperature stability on these small resistive devices was also examined and related to the resistor design.
引用
收藏
页码:359 / 365
页数:7
相关论文
共 3 条
[1]  
BERRY RW, 1968, THIN FILM TECHNOLOGY, P271
[2]  
COUTREAU T, 1991 P CAP RES TECHN, P152
[3]  
WYLIE CR, 1951, ADV ENG MATH, P238