Review of Heat Transfer Technologies in Electronic Equipment

被引:204
作者
Yeh, L. T. [1 ]
机构
[1] Loral Vought Syst Corp, POB 650003,M-S SP-97, Dallas, TX 75265 USA
关键词
D O I
10.1115/1.2792113
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thermal control has become a critical. factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management, The, further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than. fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.
引用
收藏
页码:333 / 339
页数:7
相关论文
共 111 条
[1]  
Anderson T. M., 1989, ASME HTD, V111
[2]  
[Anonymous], 1989, US AIR FORC AV INT P
[3]  
Antonetti V. W., 1985, IEEE T COMPONENT HYB
[4]  
Aziz M., 1993, ASME J HEAT TRANSFER, V115
[5]   STEADY-STATE MODELING AND TESTING OF A MICRO HEAT PIPE [J].
BABIN, BR ;
PETERSON, GP ;
WU, D .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1990, 112 (03) :595-601
[6]  
Bar-Cohen A., 1983, MECH ENG
[7]  
Bar-Cohen A., 1991, ASME JSME THERM ENG, V2
[8]  
Bar-Cohen A, 1990, ADV THERMAL MODELING, V2
[9]  
Bergles A. E., 1977, P TECHN PROGR NAT EL
[10]  
Bouzid A., 1989, ASME HTD, V11