ANALYSIS AND SIMULATION OF SUBSTRATE COUPLING IN INTEGRATED-CIRCUITS

被引:15
作者
GHARPUREY, R
MEYER, RG
机构
[1] Department of Electrical and Computer Sciences, University of California at Berkeley, Berkeley, California
关键词
D O I
10.1002/cta.4490230411
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A technique is presented which allows efficient calculation of substrate-coupling macromodels in integrated circuits. The technique can be used to calculate node-to-node resistances or impedances in substrate models. Examples of the technique applied to several test structures are presented.
引用
收藏
页码:381 / 394
页数:14
相关论文
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