AN ANALYSIS OF THE CREEP OF HOT-PRESSED SILICON-NITRIDE IN BENDING

被引:25
作者
FETT, T
KELLER, K
MUNZ, D
机构
[1] UNIV KARLSRUHE,INST KERAM MASCHINENBAU,D-7500 KARLSRUHE,FED REP GER
[2] INST ZUVERLASSIGKEIT & SCHADENSKUNDE MASCHINENBAU,D-7500 KARLSRUHE,FED REP GER
关键词
CERAMIC MATERIALS - Hot Pressing;
D O I
10.1007/BF01174671
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A knowledge of the creep behaviour of ceramic materials is of importance in computing the lifetime at high temperatures. To consider failure by subcritical crack growth as well as creep crack growth one must know the time dependent stresses for all locations of the loaded structure. The creep behaviour of hot pressed silicon nitride is investigated in four-point bend tests at temperatures of about 1200 degree C. By use of appropriate creep laws for the primary creep range as well as for the secondary range the experimental results can be well described analytically.
引用
收藏
页码:467 / 474
页数:8
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