ADVANCED COPPER POLYIMIDE HYBRID TECHNOLOGY

被引:7
作者
TAKASAGO, H
TAKADA, M
ADACHI, K
ENDO, A
YAMADA, K
MAKITA, T
GOFUKU, E
ONISHI, Y
机构
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 03期
关键词
D O I
10.1109/TCHMT.1987.1134744
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:425 / 432
页数:8
相关论文
共 5 条
[1]   THERMAL AND PHYSICAL-PROPERTIES AND ETCHING CHARACTERISTICS OF PI FILMS [J].
ENDO, A ;
YADA, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (01) :155-158
[2]  
HOSOMI K, 1984, NIKKEI ELECTRONI FEB, P203
[3]  
TAKADA M, 1984, INT MICROELECTRONICS, P447
[4]  
Takasago H., 1984, 34th Electronic Components Conference, P324
[5]  
TAKASAGO H, 1982, INT MICROELECTRONICS, P278