RELIABLE MULTIWIRE CIRCUITS WITH SMALL GAUGE WIRES

被引：6

作者：

SUGITA, E

IBARAGI, O

机构：

[1] Physical Design Section, Electronic Equipment Development Division, Musashino Electrical Communication Laboratory, NTT, Musoshino-shi, Tokyo 180, 3-9-11, Midoricho

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1979年 / 2卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1979.1135495

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Reliable Multiwire circuits have been developed. The objective of this development was to reduce design and assembly cost of backwiring boards in an electronic switching system. To realize high hole-to-wire connection reliability, various factors were investigated and the following results have been obtained. 1) The use of Pyre-ML as a wire insulating material is the most effective for obtaining high connection reliability because of its solubility in alkaline type plating solution. 2) In manufacturing processes, cleaning of resin smear is the most important process. 3) Pads around plated through-holes are effective for reduction in thermal expansion around plated through-holes and failure rate is reduced to 2 percent with pads. By using these technologies, Multiwire circuits with a wire thicker than 0.09 mm have obtained equal or higher connection reliability, compared with multilayer printed circuits. © 1979 IEEE

引用

页码：532 / 536

页数：5