MICROCRACKING IN CERAMICS INDUCED BY THERMAL-EXPANSION OR ELASTIC-ANISOTROPY

被引：692

作者：

TVERGAARD, V ^{[1
]}

HUTCHINSON, JW ^{[1
]}

机构：

[1] HARVARD UNIV,DEPT APPL SCI,CAMBRIDGE,MA 02138

来源：

JOURNAL OF THE AMERICAN CERAMIC SOCIETY | 1988年 / 71卷 / 03期

关键词：

CRYSTALS - Thermal Expansion;

D O I：

10.1111/j.1151-2916.1988.tb05022.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The effect of crystal anisotropy on the formation of grain boundary microcracks is analyzed, by considering a planar array of hexagonal grains as a model of a polycrystalline ceramic. The stress singularities at triple-grain junctions are analyzed by an asympotic method as well as by a numerical solution, and the critical size of a grain-boundary defect is investigated by a crack analysis. It is found that elastic anisotropies can significantly increase the stress levels near triple points.

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收藏

页码：157 / 166

页数：10

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