SIMULATION OF MICROSTRUCTURE AND SURFACE PROFILES OF THIN-FILMS FOR VLSI METALLIZATION

被引：13

作者：

SMY, T

DEW, SK

BRETT, MJ

机构：

来源：

关键词：

D O I：

10.1557/S0883769400045619

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

[No abstract available]

引用

页码：65 / 69

页数：5

共 16 条

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