MICROSCRATCH TESTING TO CHARACTERIZE THE ADHESION OF THIN-LAYERS

被引:34
作者
JULIASCHMUTZ, C
HINTERMANN, HE
机构
[1] Swiss Centre for Electronics, Microtechnology Incorporated, CH 2007 Neuchâtel
关键词
D O I
10.1016/0257-8972(91)90121-C
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Scratch testing using the CSEM-REVETEST instrument has become a common method to characterize the adhesive strength of thin hard layers (HV > 10 000 MPa) on softer substrates. For very thin coatings (below 1-mu-m) of various hardnesses, CSEM has recently developed a microscratch tester for loads in the range 0.01-30 N. This instrument can be used for metallurgical and ceramic coatings, as well as optical and electronic layers.
引用
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页码:1 / 6
页数:6
相关论文
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