OVERVIEW OF PACKAGING FOR THE IBM ENTERPRISE SYSTEM 9000 BASED ON THE GLASS CERAMIC COPPER THIN-FILM THERMAL CONDUCTION MODULE

被引：7

作者：

TUMMALA, RR

AHMED, S

机构：

[1] Packaging Laboratory, IBM, NY 12533, Hopewell Junction

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1992年 / 15卷 / 04期

关键词：

Computer packaging - Interconnects - Mainframes - Memory chips - Multichip modules - Printed wiring boards;

D O I：

10.1109/33.159869

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The ES/9000 models 820 And 900 high performance mainframe processors have been significantly enhanced with respect to their predecessors. This has been made possible by a number of packaging advances: 1) multilayer glass-ceramic/copper cofired substrate; 2) multilayer polyimide/copper thin film structure; 3) discrete decoupling capacitors; 4) "buried" engineering change conductors; 5) enhanced pistons for very high thermal conduction cooling; 6) enhanced flip-chip solder connections. This paper will describe some aspects of these advances in an overview fashion. It also summarizes the connectors and printed wiring board technologies used in this family of systems.

引用

页码：426 / 431

页数：6

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