FABRICATION OF SUBMICROMETER FEATURES ON CURVED SUBSTRATES BY MICROCONTACT PRINTING

被引:355
作者
JACKMAN, RJ [1 ]
WILBUR, JL [1 ]
WHITESIDES, GM [1 ]
机构
[1] HARVARD UNIV, DEPT CHEM, CAMBRIDGE, MA 02138 USA
关键词
D O I
10.1126/science.7624795
中图分类号
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号
07 ; 0710 ; 09 ;
摘要
Microcontact printing (mu CP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet-chemical etching that uses the patterned SAMs as resists transfers the patterns formed by mu CP into gold. At present, there is no comparable method for microfabrication on curved surfaces.
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页码:664 / 666
页数:3
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