INITIAL-STAGES OF COPPER ELECTRODEPOSITION IN THE PRESENCE OF ORGANIC ADDITIVES

被引：49

作者：

MICHAILOVA, E

VITANOVA, I

STOYCHEV, D

MILCHEV, A

机构：

[1] Institute of Physical Chemistry, Bulgarian Academy of Sciences

来源：

ELECTROCHIMICA ACTA | 1993年 / 38卷 / 16期

关键词：

ELECTRODEPOSITION; NUCLEATION AND GROWTH KINETICS; ORGANIC ADDITIVES; COPPER PLATING;

D O I：

10.1016/0013-4686(93)85116-G

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The nucleation and growth kinetics of copper crystals electrochemically deposited on platinum and tungsten have been studied in the presence of a composite organic additive for bright copper plating. Data were obtained for the exchange current density i0, for the transition coefficient alpha of the copper ions, for the stationary nucleation rate I(st) and for the size n(k) of the critical copper nucleus.

引用

页码：2455 / 2458

页数：4

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