RECENT ADVANCES IN SOLDER BOND TECHNOLOGY FOR MICROELECTRONIC PACKAGING

被引：5

作者：

HALL, PM

MORABITO, JM

机构：

来源：

关键词：

Compendex;

D O I：

10.1016/0040-6090(80)90527-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electronics packaging

引用

页码：433 / 442

页数：10

共 39 条

[1]

AMMANN HH, 1980, P NATL ELECTRONIC PA

[2]

ARIYOSHI H, 1978, REV ELEC COMMUN LAB, V26, P735

[3] STUDIES OF SLT CHIP TERMINAL METALLURGY [J].

BERRY, BS ;

AMES, I .

[4]

Boulos M., 1979, Insulation/Circuits, V25, P39

[5]

BURCH ML, 1977, P NATL ELECTRONIC PA, P43

[6]

DAEBLER DH, 1979, P INT MICROELECTRONI, P84

FUSS, FN ;

HARTWIG, CT ;

MORABITO, JM .

[8]

GADZINSKI E, 1979, CIRCUITS MANUF, V19, P16

[9] GEOMETRIC OPTIMIZATION OF CONTROLLED COLLAPSE INTERCONNECTIONS [J].

GOLDMANN, LS .

[10]

HALL P, UNPUBLISHED