RESISTIVE LAYERS FORMED BY ION IMPLANTATION INTO METAL FILMS

被引：7

作者：

PERKINS, JG

COLLINS, LE

机构：

来源：

THIN SOLID FILMS | 1970年 / 5卷 / 5-6期

关键词：

D O I：

10.1016/0040-6090(70)90120-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：R59 / &

共 12 条

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[2] EFFECT OF ION BOMBARDMENT ON ADHESION OF ALUMINIUM FILMS ON GLASS [J].

COLLINS, LE ;

PERKINS, JG ;

STROUD, PT .

THIN SOLID FILMS, 1969, 4 (01) :41-&

[3]

COLLINS LE, 1970, AWRE02170 REPT

[4]

Jonscher A. K., 1967, THIN SOLID FILMS, V1, P213

[5]

LINDARD J, 1963, MATH FYS MEDDR, V33

[6]

MEYER M, 1969, CR ACAD SCI B PHYS, V268, P1145

[7] A COMPARATIVE STUDY OF ANODIZED, EVAPORATED, AND SPUTTERED ALUMINUM OXIDE THIN FILMS [J].

MIER, MG ;

BUVINGER, EA .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (04) :727-&

[8]

PAVLOV PV, 1967, SOV PHYS DOKL, V12, P11

[9]

PERKINS JG, 1970, AWRE0970 REPT

[10] ELECTRICAL CONDUCTION IN AMORPHOUS SILICON AND GERMANIUM [J].

WALLEY, PA .

THIN SOLID FILMS, 1968, 2 (04) :327-&

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