IN-SITU OBSERVATIONS OF THE INITIAL-STAGE OF ELECTRODEPOSITION OF CU ON AU(100) FROM AN AQUEOUS SULFURIC-ACID-SOLUTION USING ATOMIC-FORCE MICROSCOPY

被引:50
作者
IKEMIYA, N
MIYAOKA, S
HARA, S
机构
[1] Department of Materials Science and Processing, Faculty of Engineering, Osaka University, Suita, 565
关键词
ATOMIC FORCE MICROSCOPY; COPPER; EPITAXY; GOLD; LOW INDEX SINGLE CRYSTAL SURFACES; SURFACE STRUCTURE; MORPHOLOGY; ROUGHNESS; AND TOPOGRAPHY;
D O I
10.1016/0039-6028(94)00844-2
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We have investigated the atomic structures of underpotentially deposited (UPD) Cu adlayers as well as nucleation and growth mechanisms of bulk Cu deposition on Au(100) from an aqueous sulfuric acid solution using in situ electrochemical atomic force microscopy (ECAFM). The pseudomorphic Cu(1 x 1) layer on Au(100) is formed for a first full monolayer in the presence and absence of Cl-. We have found that the completion of the UPD monolayer is followed by an ideal layer-by-layer bulk Cu deposition (Frank-van der Merwe mode) at a low overpotential range.
引用
收藏
页码:261 / 273
页数:13
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