ELECTROMIGRATION TESTING OF TI-W-AL AND TI-W-AL-CU FILM CONDUCTORS

被引：23

作者：

GHATE, PB

BLAIR, JC

机构：

来源：

THIN SOLID FILMS | 1978年 / 55卷 / 01期

关键词：

D O I：

10.1016/0040-6090(78)90079-2

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：113 / 123

页数：11

共 35 条

[1] ELECTROMIGRATION-INDUCED FAILURES IN THIN-FILM AL-CU CONDUCTORS [J].

AGARWALA, BN ;

BERENBAUM, L ;

PERESSININ, P .

JOURNAL OF ELECTRONIC MATERIALS, 1974, 3 (01) :137-153

[2] DEPENDENCE OF ELECTROMIGRATION-INDUCED FAILURE TIME ON LENGTH AND WIDTH OF ALUMINUM THIN-FILM CONDUCTORS [J].

AGARWALA, BN ;

ATTARDO, MJ ;

INGRAHAM, AP .

JOURNAL OF APPLIED PHYSICS, 1970, 41 (10) :3954-&

[3] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J].

AMES, I ;

DHEURLE, FM ;

HORSTMANN, RE .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) :461-+

[4] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J].

ATTARDO, MJ ;

ROSENBERG, R .

JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) :2381-+

[5] STATISTICAL METALLURGICAL MODEL FOR ELECTROMIGRATION FAILURE IN ALUMINUM THIN-FILM CCNDUCTORS [J].

ATTARDO, MJ ;

RUTLEDGE, R ;

JACK, RC .

JOURNAL OF APPLIED PHYSICS, 1971, 42 (11) :4343-&

[6]

BAKER AH, 1972, ENGINEERING STATISTI, P325

[7] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS [J].

BLACK, JR .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) :338-&

[8] DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS [J].

BLECH, IA ;

MEIERAN, ES .

APPLIED PHYSICS LETTERS, 1967, 11 (08) :263-&

[9]

BLECH IA, 1965, TR6631 GRIFF AIR FOR

[10]

BLECH IA, 1967, PHYS FAIL ELECTRON, V5, P496

← 1 2 3 4 →