MEASURING MOLDED CASE CIRCUIT-BREAKER RESISTANCE

被引:12
作者
SHEA, JJ
BINDAS, JA
机构
[1] Westinghouse Science and Technology Center, Pittsburgh
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1993年 / 16卷 / 02期
关键词
MOLDED CASE CIRCUIT BREAKER (MCCB); MILLIVOLT DROP; CONTACT RESISTANCE;
D O I
10.1109/33.219405
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Molded case circuit breaker resistance was measured under various conditions to demonstrate the need for more standardized procedures when performing millivolt drop measurements. Breakers, rated at 600 V(ac)/250 A(ac) and 120/240 V(ac)/50 A(ac), with silver-tungsten (Ag-W) contacts were used to show that contact resistance can cause variability in circuit breaker resistance. These breakers were used to demonstrate the influence of current, time, contact temperature, and applied voltage on contact resistance. These parameters each had a unique influence on breaker resistance. Based on these results, guidelines were made for making reliable resistance measurements on molded case circuit breakers (MCCB's) when using the millivolt drop technique.
引用
收藏
页码:196 / 202
页数:7
相关论文
共 10 条
[1]  
Barin I., 1973, THERMOCHEMICAL PROPE
[2]  
BENNETT H, 1986, CONCISE CHEM TECHNIC
[3]  
BROWNE TE, 1984, CIRCUIT INTERRUPTION, pCH15
[4]  
CLARK FM, 1962, INSULATING MATERIALS, P1058
[5]  
Hawley G.G., 1977, CONDENSED CHEM DICT, V9th ed.
[6]  
HOLM R, 1967, ELECTRIC CONTACTS
[7]   EFFECTS OF ELECTRICAL CONDUCTIVITY AND OXIDATION RESISTANCE ON TEMPERATURE RISE OF CIRCUIT-BREAKER CONTACT MATERIALS [J].
KOSCO, JC .
IEEE TRANSACTIONS ON PARTS MATERIALS AND PACKAGING, 1969, PMP5 (02) :99-&
[8]   VARIATIONS IN CONTACT RESISTANCE RESULTING FROM OXIDE FORMATION AND DECOMPOSITION IN AG-W AND AG-WC-C CONTACTS PASSING STEADY CURRENTS FOR LONG-TIME PERIODS [J].
SLADE, PG .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1986, 9 (01) :3-16
[9]  
TURNER C, 1967, P ENG SEM EL CONT PH, P233
[10]  
WITTER GJ, 1976, 8TH P INT C EL CONT, P446