EFFECT OF FILLERS ON KINETICS OF EPOXY CURE

被引：132

作者：

DUTTA, A

RYAN, ME

机构：

[1] Department of Chemical Engineering, State University of New York at Buffalo, Amherst, New York

来源：

JOURNAL OF APPLIED POLYMER SCIENCE | 1979年 / 24卷 / 03期

关键词：

D O I：

10.1002/app.1979.070240302

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 [高分子化学与物理]; 080501 [材料物理与化学]; 081704 [应用化学];

摘要：

The effect of fillers on the reaction of liquid epoxy systems cured with m‐phenylenediamine has been studied within the temperature range 70–170°C using a Perkin–Elmer differential scanning calorimeter. Quantitative studies have been made with regard to the effect of filler on the kinetics of cure. Mathematical expressions have been devised to describe the curing reaction as a function of time, temperature, and filler content. These kinetic expressions were found to yield results which were in good agreement with the experimental data for the two fillers studied. Copyright © 1979 John Wiley & Sons, Inc.

引用

页码：635 / 649

页数：15

共 45 条

[1]

ABOLAFIA OR, 1969, SPE TECHNICAL PAPERS, V15, P610

[2]

KINETICS OF EPOXY CURE .1. SYSTEM BISPHENOL-A DIGLYCIDYL ETHER/META PHENYLENE DIAMINE [J].