CODEPOSITION OF ALPHA-ALUMINA PARTICLES FROM ACID COPPER-SULFATE BATH

被引：36

作者：

HAYASHI, H

IZUMI, S

TARI, I

机构：

[1] Department of Applied Chemistry, Faculty of Engineering, Okayama University, Tsushima, Okayama

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1993年 / 140卷 / 02期

关键词：

D O I：

10.1149/1.2221051

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The purpose of this work is to elucidate the factors affecting the codeposition of alpha-alumina particles with copper from an acid copper sulfate bath. The effect of current density and particle concentration in the bath on the amount of codeposited alpha-alumina were determined. In order to evaluate the surface-chemical properties of the particles, the zeta-potential of alpha-alumina particles in the plating bath was determined by means of the streaming potential method. The amounts of adsorbed Cu2+ and SO42- from the plating bath were also determined. The amount of codeposited alpha-alumina particles was found to be greater than those reported in literature, in spite of the negative zeta-potential values of alpha-alumina. This indicates that the electrostatic interaction between the particles and the cathode is not the essential factor of the codeposition process. It is considered that the amount of adsorbed Cu2+ on the alpha-alumina particle plays an important role in the codeposition behavior.

引用

页码：362 / 365

页数：4

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