THERMAL-ANALYSIS OF MULTIPLE-LAYER STRUCTURES

[1] BLIVIN CR, 1969, NATIONAL ELECTRONIC, P62

[2] BUDENSTEIN PP, 1970, AD721294 US ARM MISS

[3] ELLISON GN, 1973, IEEE DEVICE, VED20, P233

[4] GRAY PR, 1971, IEEE J SOLID STATE C, VSC 6, P8

[5] GRAY PR, 1974, IEEE J SOLID STATE C, VSC 9, P61

[6] GRAY PV, PRIVATE COMMUNICATIO

[7] Jaegar J. C., 1986, Conduction of Heat in Solids

[8] LIN HC, 1958, SEMICONDUCTOR PRODUC, V1, P21

[9] LINDSTED RD, 1972, IEEE T ELECTRON DEV, VED19, P41

[10] LONG EL, 1971, IEEE J SOLID STATE C, VSC 6, P35

[1] BLIVIN CR, 1969, NATIONAL ELECTRONIC, P62

[2] BUDENSTEIN PP, 1970, AD721294 US ARM MISS

[3] ELLISON GN, 1973, IEEE DEVICE, VED20, P233

[4] GRAY PR, 1971, IEEE J SOLID STATE C, VSC 6, P8

[5] GRAY PR, 1974, IEEE J SOLID STATE C, VSC 9, P61

[6] GRAY PV, PRIVATE COMMUNICATIO

[7] Jaegar J. C., 1986, Conduction of Heat in Solids

[8] LIN HC, 1958, SEMICONDUCTOR PRODUC, V1, P21

[9] LINDSTED RD, 1972, IEEE T ELECTRON DEV, VED19, P41

[10] LONG EL, 1971, IEEE J SOLID STATE C, VSC 6, P35