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SUPERIOR ALUMINUM FOR INTERCONNECTIONS OF INTEGRATED CIRCUITS
被引:23
作者
:
BHATT, HJ
论文数:
0
引用数:
0
h-index:
0
BHATT, HJ
机构
:
来源
:
APPLIED PHYSICS LETTERS
|
1971年
/ 19卷
/ 02期
关键词
:
D O I
:
10.1063/1.1653810
中图分类号
:
O59 [应用物理学];
学科分类号
:
摘要
:
引用
收藏
页码:30 / &
相关论文
共 5 条
[1]
BARRETT CR, 1965, T METALL SOC AIME, V233, P1116
[2]
DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS
BLECH, IA
论文数:
0
引用数:
0
h-index:
0
BLECH, IA
MEIERAN, ES
论文数:
0
引用数:
0
h-index:
0
MEIERAN, ES
[J].
APPLIED PHYSICS LETTERS,
1967,
11
(08)
: 263
-
&
[3]
CHRISTIAN JW, 1963, AIME METALLURGICAL S, V29
[4]
HUMMEL RE, U FLORIDA DEP METALL
[5]
RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS
ROSENBERG, R
论文数:
0
引用数:
0
h-index:
0
机构:
IBM Watson Research Center, Yorktown Heights
ROSENBERG, R
BERENBAUM, L
论文数:
0
引用数:
0
h-index:
0
机构:
IBM Watson Research Center, Yorktown Heights
BERENBAUM, L
[J].
APPLIED PHYSICS LETTERS,
1968,
12
(05)
: 201
-
+
←
1
→
共 5 条
[1]
BARRETT CR, 1965, T METALL SOC AIME, V233, P1116
[2]
DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMS
BLECH, IA
论文数:
0
引用数:
0
h-index:
0
BLECH, IA
MEIERAN, ES
论文数:
0
引用数:
0
h-index:
0
MEIERAN, ES
[J].
APPLIED PHYSICS LETTERS,
1967,
11
(08)
: 263
-
&
[3]
CHRISTIAN JW, 1963, AIME METALLURGICAL S, V29
[4]
HUMMEL RE, U FLORIDA DEP METALL
[5]
RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS
ROSENBERG, R
论文数:
0
引用数:
0
h-index:
0
机构:
IBM Watson Research Center, Yorktown Heights
ROSENBERG, R
BERENBAUM, L
论文数:
0
引用数:
0
h-index:
0
机构:
IBM Watson Research Center, Yorktown Heights
BERENBAUM, L
[J].
APPLIED PHYSICS LETTERS,
1968,
12
(05)
: 201
-
+
←
1
→