ISSUES IN THE REPLACEMENT OF LEAD-BEARING SOLDERS

被引:194
作者
VIANCO, PT [1 ]
FREAR, DR [1 ]
机构
[1] SANDIA NATL LABS,DEPT MECH & CORROS MET,ALBUQUERQUE,NM 87185
来源
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 1993年 / 45卷 / 07期
关键词
D O I
10.1007/BF03222374
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The use of soft solders, particularly those containing lead, dates back nearly 5,000 years. Solders similar to the materials used to seal the aqueducts of ancient Rome are now an important building block in the manufacture of high-speed computer assemblies. This history attests to the technological versatility of soft solders and, in particular, the solder alloys that contain lead. However, the health effects of prolonged exposure to lead have also been documented; measures to limit human exposure-at the work place and indirectly through the environment-are being considered. The successful introduction of lead-free solders in to future electronic products will rely heavily upon their solderability, which can be evaluated by test procedures such as the meniscometer/wetting balance technique and the capillary flow test.
引用
收藏
页码:14 / 19
页数:6
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