THERMAL CONTACT RESISTANCE OF SELECTED LOW-CONDUCTANCE INTERSTITIAL MATERIALS

被引：16

作者：

FLETCHER, LS

SMUDA, PA

GYOROG, DA

机构：

来源：

AIAA JOURNAL | 1969年 / 7卷 / 07期

关键词：

D O I：

10.2514/3.5338

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

Experimental investigation has been conducted to determine the thermal isolation characteristics of some low-conductance interstitial materials. Bare junction resistance for aluminum specimens in contact was compared with data obtained using the interstitial materials. Resistance to heat transfer was increased by factors from 2 to 1000 as a result of the interstitial materials. The experimental results are presented in tabular and graphical form, with a discussion of the interstitial material effectiveness in thermal isolation applications such as are found in spacecraft.

引用

页码：1302 / &

共 18 条

[1]

Atkins H., 1965, X53227 NASA TM

[2]

Barzelay M. E., 1960, D426 NASA TN

[3]

BRUNOT AW, 1949, T ASME, V71, P253

[4]

CETINKALE TN, 1951, SEP P GEN DISC HEAT, P271

[5]

CLAUSING AM, 1963, METN2421 U ILL EXP S

[6]

CUNNINGTON GR, 1964, 64WAHT40 ASME PAP

[7]

DAILEY RM, 1964, X53055 NASA TM, P108

[8]

ELDRIDGE EA, 1961, 296 AM SOC TEST MAT

[9] INTERFACE THERMAL CONTACT RESISTANCE PROBLEM IN SPACE VEHICLES [J].

FRIED, E ;

COSTELLO, FA .

ARS JOURNAL, 1962, 32 (02) :237-243

[10]

FRIED E, 65SD4395 GEN EL SPAC

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