FAILURE MODES IN GOLD-ALUMINUM THERMOCOMPRESSION BONDS

被引：6

作者：

ANDERSON, JH

COX, WP

机构：

[1] Lockheed Missiles and Space Company, University of Rochester, Palo Alto, Calif.

来源：

IEEE TRANSACTIONS ON RELIABILITY | 1969年 / R 18卷 / 04期

关键词：

D O I：

10.1109/TR.1969.5216358

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Electrical opens and mechanical fracture have been reported as two distinct failure modes in gold–aluminum thermocompression ball bonds. It is found that the thickness of the aluminum film to which the gold wires are bonded and the temperature at which the bonds are held during aging determine which failure mode will be observed. The electrical failure mode predominates when bonds made to aluminum films 5000Å or more in thickness are aged at temperatures above 200°C but at 200°C both failure modes are observed. Mechanical fracture is expected to be the dominant failure mode when ball bonds to these5000-10000-Åfilms are aged at temperatures below 200°C. Bonds to thinner aluminum films (500-3000Å) exhibited only the electrical failure mode. Copyright © 1970 by The Institute of Electrical and Electronics Engineers, Inc.

引用

页码：206 / &