REACTIVE ION ETCHING INDUCED CORROSION OF AL AND AL-CU FILMS

被引：56

作者：

LEE, WY ^{[1
]}

ELDRIDGE, JM ^{[1
]}

SCHWARTZ, GC ^{[1
]}

机构：

[1] IBM CORP,E FISHKILL FACIL,DIV SYST PROD,HOPEWELL JUNCTION,NY 12533

来源：

关键词：

D O I：

10.1063/1.329043

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：2994 / 2999

页数：6

共 26 条

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