CHEMICAL CLEANING FOR THERMOCOMPRESSION BONDING

被引:9
作者
HOLLOWAY, PH [1 ]
LONG, RL [1 ]
机构
[1] SANDIA LABS,ALBUQUERQUE,NM 87115
来源
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1975年 / PH11卷 / 02期
关键词
D O I
10.1109/TPHP.1975.1135042
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:83 / 88
页数:6
相关论文
共 10 条
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  • [2] Hicks C.R., 1964, FUNDAMENTAL CONCEPTS
  • [3] HOLLOWAY PH, SLA731099
  • [4] HOLLOWAY PH, 1974, SLA731049 SAND LAB R
  • [5] HOLLOWAY PH, 1974, 12TH P ANN REL PHYS, P180
  • [6] KENNA BT, 1973, SLA73793 SAND LAB RE
  • [7] Milner DR., 1962, MTLR, V7, P433
  • [8] PANOUSIS NT, 1973, 11TH P ANN REL PHYS, P21
  • [9] TETELMAN A. S., 1967, FRACTURE STRUCTURAL
  • [10] TYLECOTE FF, 1968, SOLID PHASE WELDING