CAUSES OF CRACKS IN SMD AND TYPE SPECIFIC REMEDIES

被引：25

作者：

OMI, S

FUJITA, K

TSUDA, T

MAEDA, T

机构：

[1] VLSI Development Laboratories, IC Group, SHARP Corporation, Tenri, Nara

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1991年 / 14卷 / 04期

关键词：

D O I：

10.1109/33.105139

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Packages used with surface-mount devices (SMD's) have the unique reliability problems of package cracks arising due to soldering stress. Package cracks can be divided into three distinct types. To remedy this problem of cracking, it is necessary to determine the type of cracking that may occur, and take countermeasures specific to each type. In this paper, we investigated possible causes for each type of package crack, and techniques for optimized crackproof package design for individual crack types were developed.

引用

页码：818 / 823

页数：6