SURFACE MOBILITY MECHANISM OF STRESS-CORROSION CRACKING

被引:52
作者
GALVELE, JR
机构
[1] Departamento Materiales, Comisión Nacional de Energía Atómica, 1429 Buenos Aires
关键词
D O I
10.1016/0010-938X(93)90175-G
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The surface mobility stress-corrosion cracking mechanism is based on the assumption that environmentally induced crack propagation is due to the capture of vacancies by the stressed lattice, at the tip of the crack. The present paper shows that the role of the environment is not only to change the surface self-diffusivity of the metal or alloy, but also to supply the metal surface with the vacancies consumed by the crack propagation process. The achievements, advantages and limitations of the mechanism are discussed, and compared with the limitations found in other alternative mechanisms. Special attention is given to the principles involved in the anodic dissolution based mechanisms.
引用
收藏
页码:419 / 434
页数:16
相关论文
共 66 条
[1]   EMBRITTLEMENT OF COPPER BY THE SURFACE MOBILITY MECHANISM [J].
BIANCHI, GL ;
GALVELE, JR .
CORROSION SCIENCE, 1987, 27 (06) :631-635
[2]  
BRUEMMER SM, 1992, PARKINS S FUNDAMENTA
[3]   REPASSIVATION KINETICS IN STRESS-CORROSION CRACKING .1. TYPE AISI-304 STAINLESS-STEEL IN CHLORIDE SOLUTIONS [J].
CARRANZA, RM ;
GALVELE, JR .
CORROSION SCIENCE, 1988, 28 (03) :233-249
[4]   REPASSIVATION KINETICS IN STRESS-CORROSION CRACKING .2. ALPHA-BRASS IN NON-AMMONIACAL SOLUTIONS [J].
CARRANZA, RM ;
GALVELE, JR .
CORROSION SCIENCE, 1988, 28 (09) :851-865
[5]   A POINT-DEFECT MODEL FOR ANODIC PASSIVE FILMS .1. FILM GROWTH-KINETICS [J].
CHAO, CY ;
LIN, LF ;
MACDONALD, DD .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1981, 128 (06) :1187-1194
[6]   FIRST STAGES OF DEPOSITION OF BISMUTH ON COPPER EXAMINED BY LEED .1. (100) SUBSTRATE [J].
DELAMARE, F ;
RHEAD, GE .
SURFACE SCIENCE, 1973, 35 (01) :172-184
[7]   FIRST STAGES OF DEPOSITION OF BISMUTH ON COPPER EXAMINED BY LEED .2. (111) SUBSTRATE [J].
DELAMARE, F ;
RHEAD, GE .
SURFACE SCIENCE, 1973, 35 (01) :185-193
[8]   INCREASE IN SURFACE SELF-DIFFUSION OF COPPER DUE TO CHEMISORPTION OF HALOGENS [J].
DELAMARE, F ;
RHEAD, GE .
SURFACE SCIENCE, 1971, 28 (01) :267-&
[9]   MECHANISM OF ACCELERATION OF ELECTRODIC DISSOLUTION OF METALS DURING YIELDING UNDER STRESS [J].
DESPIC, AR ;
RAICHEFF, RG ;
BOCKRIS, JOM .
JOURNAL OF CHEMICAL PHYSICS, 1968, 49 (02) :926-&
[10]  
DOIG P, 1981, METALL TRANS A, V12, P923, DOI 10.1007/BF02643473