STRUCTURAL AND ELECTRICAL PROPERTIES OF CHROMIUM AND NICKEL FILMS EVAPORATED IN PRESENCE OF OXYGEN

被引：28

作者：

HIEBER, K

LASSAK, L

机构：

[1] SIEMENS AG,FORSCH LAB,BALAN STR 73,8 MUNICH 80,WEST GERMANY

[2] SIEMENS AG,UNTERNEHMENSBEREICH BAUELEMENTE,BALAN STR 73,8 MUNICH,80,WEST GERMANY

来源：

关键词：

D O I：

10.1016/0040-6090(74)90034-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：63 / 73

页数：11

共 8 条

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HEAD, K
[J]. THIN SOLID FILMS, 1969, 4 (03) : 153 - &
[3] LASSAK L, 1973, THIN SOLID FILMS, V17, P107
[4] Maissel L.I., 1970, HDB THIN FILM TECHNO
[5] RESISTIVITY OF CERMET FILMS CONTAINING OXIDES OF SILICON
NEUGEBAUER, CA
[J]. THIN SOLID FILMS, 1970, 6 (06) : 443 - +
[6] POLITYCKI A, 1972, VIDE S
[7] SCHAFER A, 1972, Z METALLK, V11, P720
[8] 1969, NBS2704 TECH NOT