THERMAL FATIGUE IN SOLDER JOINTS

被引：41

作者：

FREAR, DR

GRIVAS, D

MORRIS, JW

机构：

[1] UNIV CALIF BERKELEY,MET,BERKELEY,CA 94720

[2] UNIV CALIF BERKELEY LAWRENCE BERKELEY LAB,CTR ADV MAT,BERKELEY,CA 94720

来源：

JOURNAL OF METALS | 1988年 / 40卷 / 06期

关键词：

D O I：

10.1007/BF03258168

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：18 / 22

页数：5

共 24 条

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[4] THE EFFECT OF CU6SN5 WHISKER PRECIPITATES IN BULK 60SN-40PB SOLDER
FREAR, D
GRIVAS, D
MORRIS, JW
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (03) : 181 - 186
[5] A MICROSTRUCTURAL STUDY OF THE THERMAL FATIGUE FAILURES OF 60SN-40PB SOLDER JOINTS
FREAR, D
GRIVAS, D
MORRIS, JW
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1988, 17 (02) : 171 - 180
[6] FREAR D, 1987, SPR TMS C DENV, P113
[7] FREAR D, UNPUB MET T A
[8] FREAR D, 1986, MATER RES SOC S P, V72, P181
[9] FREAR D, 1985, 43RD P ANN M EMSA, V43, P342
[10] FREAR DR, 1987, 3RD P ANN EL PACK CO, V3, P269