SILVER-PALLADIUM THICK-FILM CONDUCTORS

被引:108
作者
WANG, SF
DOUGHERTY, JP
HUEBNER, W
PEPIN, JG
机构
[1] PENN STATE UNIV, MAT RES LAB, CTR DIELECT STUDIES, UNIVERSITY PK, PA 16802 USA
[2] UNIV MISSOURI, DEPT CERAM ENGN, ROLLA, MO 65401 USA
[3] DUPONT ELECTR, RES TRIANGLE PK, NC 27709 USA
关键词
D O I
10.1111/j.1151-2916.1994.tb04549.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The trends in integrated circuit packaging technology are toward high speed, high density, reliability, and low cost. These demand the improvement of material formulations and processing technology. Among the thick-film materials systems, conductor materials generally represent an important and the most expensive element. Therefore, attention has been centered on the performance of the fired metal film and its cost. Silver and palladium (Ag/Pd) conductors are important components of thick-film paste technology. Thick-film Ag/Pd conductors find applications in many aspects of electronics and electronic packaging, such as hybrid microcircuits, multichip modules, packaging for integrated microcircuits, and in passive electronic components such as multilayer capacitors, varistors, and inductors. In this paper, the performance and properties are correlated to a number of factors, including thermodynamics and kinetics of Pd oxidation during burnout and firing; chemical and physical reaction of the Ag/Pd with the ceramic substrate, organic vehicle, and solder; Ag diffusion and migration; inorganic and organic additives; powders characteristics; and paste properties.
引用
收藏
页码:3051 / 3072
页数:22
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