BELLPAC MODULAR ELECTRONIC PACKAGING SYSTEM

被引：8

作者：

HARROD, WL ^{[1
]}

LUBOWE, AG ^{[1
]}

机构：

[1] BELL TEL LABS INC, INTERCONNECT TECHNOL LAB, BELLPAC PROTOTYPE & ASSEMBLY GRP, MURRAY HILL, NJ 07974 USA

来源：

BELL SYSTEM TECHNICAL JOURNAL | 1979年 / 58卷 / 10期

关键词：

D O I：

10.1002/j.1538-7305.1979.tb02966.x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The BELLPAC* system is a family of electronic packaging modules being used in the physical design of more than 40 new Bell Laboratories‐developed systems. The BELLPAC system consists of a set of circuit packs, connectors (both circuit pack and backplane), and shelf hardware. A range of circuit pack sizes and interconnection densities is provided to match system packaging needs. Present elements include circuit pack connectors with pin‐outs ranging from 50 to 300, circuit pack sizes ranging from 30 to 100 square inches, and circuit pack technologies ranging from simple, low‐density, epoxy glass (or epoxy‐coated metal) circuits up to fine‐line multilayer boards. In this paper, we review the physical design of the BELLPAC system. We also describe the large body of design and manufacturing support information available to system development organizations using BELLPAC hardware. © 1979 The Bell System Technical Journal

引用

页码：2271 / 2288

页数：18