A RELIABLE LOW THERMAL RESISTANCE BOND BETWEEN DIELECTRICS AND METALS FOR USE AT LOW TEMPERATURES

被引：2

作者：

BROWN, MA

机构：

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D O I：

10.1016/0011-2275(70)90018-4

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

引用

页码：439 / &

共 6 条

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BARNES, LJ
DILLINGER, JR
[J]. PHYSICAL REVIEW LETTERS, 1963, 10 (07) : 287 - &
[2] THERMAL CONDUCTION ACROSS COPPER-LEAD-COPPER SANDWICHES AT HELIUM TEMPERATURES
CHALLIS, LJ
CHEEKE, JDN
[J]. PROCEEDINGS OF THE PHYSICAL SOCIETY OF LONDON, 1964, 83 (5311): : 109 - &
[3] HASS ND, 1959, REV SCI INSTR, V30, P594
[4] NEEPER DA, 1964, PHYS REV, V135, P1028
[5] SZABO A, 1961, REV SCI INSTR, V31, P1256
[6] WHITE GK, 1968, EXPT TECHNIQUES LOW, P380