COOLING OF A MULTICHIP ELECTRONIC MODULE BY MEANS OF CONFINED 2-DIMENSIONAL JETS OF DIELECTRIC LIQUID

Experiments were performed to investigate single-phase heat transfer from a smooth 12.7 × 12.7 mm2 simulated chip to a two-dimensional jet of dielectric Fluorinert FC-72 liquid issuing from a thin rectangular slot into a channel confined between the chip surface and nozzle plate. The effects of jet width, confinement channel height, and impingement velocity have been examined. Channel height had a negligible effect on the heat transfer performance of the jet for the conditions of the present study. A correlation for the convective heat transfer coefficient is presented as a function of jet width, heater length, flow velocity, and fluid properties. A self-contained multichip cooling module consisting of a 3 × 3 array of heat sources confirmed the uniformity and predictability of cooling for each of the nine chips, and proved the cooling module is well suited for packaging large arrays of high-power density chips. © 1990 by ASME.