INFLUENCE OF DEPOSITION CONDITIONS AND SUBSTRATE STRUCTURE ON STRUCTURE OF SPUTTERED TELLURIUM-FILMS

被引:15
作者
MARINKOVIC, Z [1 ]
ROY, R [1 ]
机构
[1] PENN STATE UNIV,MAT RES LAB,UNIVERSITY PK,PA 16802
关键词
D O I
10.1016/0040-6090(74)90180-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:355 / 359
页数:5
相关论文
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[3]   TEMPERATURE RISE DURING FILM DEPOSITION BY RF AND DC SPUTTERING [J].
LAU, SS ;
MILLS, RH ;
MUTH, DG .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (04) :1196-&
[4]  
MESSIER R, 1973, THESIS PENNSYLVANIA
[5]  
WIEDMANN E, 1971, THIN SOLID FILMS, V7, P27
[6]  
WIEDMANN EJ, 1971, THIN SOLID FILMS, V7, P265