THERMAL-EXPANSION OF CUPROUS-OXIDE AT LOW-TEMPERATURES

被引：29

作者：

WHITE, GK

机构：

来源：

JOURNAL OF PHYSICS C-SOLID STATE PHYSICS | 1978年 / 11卷 / 11期

关键词：

D O I：

10.1088/0022-3719/11/11/009

中图分类号：

O469 [凝聚态物理学];

学科分类号：

070205 ;

摘要：

引用

页码：2171 / 2174

页数：4

共 11 条

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[3]

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BROWER, WS ;

PARKER, HS .

PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 1974, 25 (01) :69-76

[9] LOW-TEMPERATURE THERMAL-EXPANSION AND GRUNEISEN PARAMETERS OF SOME TETRAHEDRALLY BONDED SOLIDS [J].

SMITH, TF ;

WHITE, GK .

JOURNAL OF PHYSICS C-SOLID STATE PHYSICS, 1975, 8 (13) :2031-2042

[10] Thermal Expansion of Copper, Silver, and Gold at Low Temperatures [J].

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