SILICONE-RUBBER ADHESIVES AS ENCAPSULANTS FOR MICROELECTRONIC IMPLANTS - EFFECT OF HIGH ELECTRIC-FIELDS AND OF TENSILE-STRESS

被引：13

作者：

DONALDSON, PEK ^{[1
]}

SAYER, E ^{[1
]}

机构：

[1] MRC,NEUROL PROSTHESES UNIT,LONDON SE5 8BB,ENGLAND

来源：

关键词：

D O I：

10.1007/BF02457937

中图分类号：

TP39 [计算机的应用];

学科分类号：

081203 ; 0835 ;

摘要：

引用

页码：712 / 715

页数：4

共 6 条

[1]

BRINDLEY GS, 1977, EEG CLIN NEUROPHYSIO, V41, P539

[2] EXPERIMENTAL VISUAL PROSTHESIS [J].

DONALDSON, PE .

PROCEEDINGS OF THE INSTITUTION OF ELECTRICAL ENGINEERS-LONDON, 1973, 120 (02) :281-298

DONALDSON, PEK .

DONALDSON, PEK ;

SAYER, E .

MEDICAL & BIOLOGICAL ENGINEERING, 1975, 13 (04) :595-596

[5]

DONALDSON PEK, 1973, IERE C HYBRID MICROE, P261

[6]

IVALL TE, 1975, WIRELESS WORLD, V81, P156