ELECTROLESS SILVER PLATING OF OXIDE PARTICLES IN AQUEOUS-SOLUTION

被引：35

作者：

CHANG, H ^{[1
]}

PITT, CH ^{[1
]}

ALEXANDER, GB ^{[1
]}

机构：

[1] UNIV UTAH,DEPT MET ENGN,SALT LAKE CITY,UT 84112

来源：

JOURNAL OF MATERIALS SCIENCE | 1993年 / 28卷 / 19期

关键词：

D O I：

10.1007/BF00570065

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

It has been demonstrated that silver could be plated on colloidal oxides by reducing silver salts in the presence of colloidal oxides in aqueous solution. In this electroless plating manner, silver coatings have been applied to colloidal silica, tin oxide and to these colloids which have previously been coated with a few monolayers of tin silicate. Data from this study have demonstrated the technical feasibility of electroless plating for the preparation of silver tin oxide composites as a source of this material for electrical contact materials.

引用

页码：5207 / 5210

页数：4