A NEW MULTILEVEL INTERCONNECTION SYSTEM FOR SUBMICROMETER VLSIS USING MULTILAYERED DIELECTRICS OF PLASMA SILICON-OXIDE AND LOW-THERMAL-EXPANSION POLYIMIDE

被引:18
作者
MISAWA, Y
KINJO, N
HIRAO, M
NUMATA, S
MOMMA, N
机构
关键词
D O I
10.1109/T-ED.1987.22972
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:621 / 627
页数:7
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