AUTOMATED VISION SYSTEM FOR INSPECTION OF IC PADS AND BONDS

被引：20

作者：

SREENIVASAN, KK

SRINATH, M

KHOTANZAD, A

机构：

[1] Image Processing and Analysis Laboratory, Electrical Engineering Department, Southern Methodist University, Dallas

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1993年 / 16卷 / 03期

关键词：

D O I：

10.1109/33.232061

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

One of the problems in increasing reliability in the manufacture of integrated circuit devices is inspection of the bond pads and the bonds connecting the bond pads to the lead fingers of the device. The continuing increase in packing density of VLSI circuits requires that the inspection process be completely automated. Here, we present methods for visual inspection of bond pads and bonds, which are intended to automatically extract parameters of significance in determining their quality, from two-dimensional images taken from the top of the IC wafer.

引用

页码：333 / 338

页数：6