BONDING OF NOBLE-METALS TO SEMICONDUCTOR SURFACES - 1ST PRINCIPLES CALCULATIONS OF CU AND AG ON SI(111)

被引：15

作者：

CHOU, SH

FREEMAN, AJ

GRIGORAS, S

GENTLE, TM

DELLEY, B

WIMMER, E

机构：

[1] DOW CORNING CORP, MIDLAND, MI 48640 USA

[2] NORTHWESTERN UNIV, DEPT PHYS, EVANSTON, IL 60201 USA

[3] RCA LABS LTD, CH-8042 ZURICH, SWITZERLAND

[4] CRAY RES INC, MENDOTA HTS, MN 55120 USA

来源：

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY | 1987年 / 109卷 / 06期

关键词：

D O I：

10.1021/ja00240a059

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

引用

页码：1880 / 1881

页数：2

共 17 条

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