BONDING AND ELECTRICAL CONTACT RESISTIVITY OF AG-YBA2CU3O7-X JOINTS

被引：3

作者：

ECHIGOYA, J

HISAMUNE, N

SUTO, H

机构：

[1] Department of Meterials Processing, Faculty of Engineering, Tohoku University, Sendai, Miyagi-ken, 980, Aza Aoba, Aramaki, Aoba-ku

[2] Graduate Student, Tohoku University

来源：

ISIJ INTERNATIONAL | 1990年 / 30卷 / 12期

关键词：

HIGH TEMPERATURE SUPERCONDUCTOR; ELECTRICAL CONTACT RESISTIVITY; SILVER; HOT PRESSING; BONDING; PEEL TEST;

D O I：

10.2355/isijinternational.30.1078

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

The bonding of Ag with YBa2Cu3O7-x(YBCO) superconductor was made by hot pressing and vacuum deposition. The electrical contact resistivity and adhesive force at the interface were measured. The following have been obtained. The hot pressing above the temperature of 670 K for 18 ks gives a good bonding of Ag with YBCO. It aids the penetration of Ag into pores of YBCO. TEM observation revealed that the bonded interface has two kinds of morphology, that is with or without third phase. The electrical contact resistivity less than 10(-5)-OMEGA-cm2 at 77 K is obtained in the hot pressed or annealed samples above 770 K. The adhesion force estimated from a peel test increased with the increase of the hot pressing temperatures. The fracture developes at YBCO grain boundaries as well as at the interface between Ag and YBCO. The optimum annealing temperature was determined as 770 K from the present experiments.

引用

页码：1078 / 1085

页数：8

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