USE OF THERMALLY STIMULATED DISCHARGE MEASUREMENTS FOR THE INVESTIGATION OF CURE AND CHARACTERIZATION OF THERMOSET-EPOXY RESINS SYSTEMS

Thermally stimulated discharge (TSD) measurements have been used to monitor the cure in thermoset resins and this paper attempts a critical assessment of its application to epoxy resin systems. These studies show that, whilst the method can be used for monitoring cure, there are problems concerned with the detailed interpretation of the TSD data. The observed TSD peaks are complex and associated with charge migration coupled with dipolar reorientation. Data for a wide range of systems and conditions used in cure are discussed.