ELASTO-PLASTIC ANALYSIS OF THE PEEL TEST FOR THIN-FILM ADHESION

被引：130

作者：

KIM, KS ^{[1
]}

KIM, J ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,PACKAGING MAT SCI,YORKTOWN HTS,NY 10598

来源：

JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME | 1988年 / 110卷 / 03期

关键词：

D O I：

10.1115/1.3226047

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

引用

收藏

页码：266 / 273

页数：8

相关论文

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