DESIGN OF LOW DIELECTRIC GLASS+CERAMICS FOR MULTILAYER CERAMIC SUBSTRATE

被引：49

作者：

JEAN, JH ^{[1
]}

GUPTA, TK ^{[1
]}

机构：

[1] ALCOA TECH CTR,CTR ELECTR PACKAGING,ALCOA CTR,PA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1994年 / 17卷 / 02期

关键词：

D O I：

10.1109/96.330424

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Compositional design and properties of a low dielectric constant glass+ceramics, containing borosilicate glass, high silica glass and alumina, for multilayer ceramic substrates are described. The new low, dielectric system can be densified at below 1000-degrees-C in air, allowing high electrical conductivity metallization including Au and Ag-Pd. Compositions with tailor-made properties are designed according to a working model based upon mixing rule, and validated with experimental results. Compositions with a thermal expansion coefficient compatible with Si and GaAs, and a dielectric constant in the range of 4-4.5 and 5-6, respectively, are developed.

引用

页码：228 / 233

页数：6

共 22 条

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[2]

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[3]

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