CRYSTAL ORIENTATION DEPENDENCE OF MACHINING DAMAGE - A STRESS MODEL

被引:36
作者
BLACKLEY, WS
SCATTERGOOD, RO
机构
[1] Precision Engineering Center, North Carolina State University, Raleigh, North Carolina
关键词
crystals; machining; modeling; orientation; stress;
D O I
10.1111/j.1151-2916.1990.tb06730.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The pitting damage occurring along preferred crystal orientations observed after single‐point diamond turning of brittle materials dictates a limiting feed rate at which the material can be machined. Using elasticity theory, the orientation dependence of the pitting can be qualitatively explained. Calculations based on a line‐force stress model predict the orientation dependece of the damage symmetry. The results are in good agreement with machining tests for a series of germanium single‐crystal wafers. Copyright © 1990, Wiley Blackwell. All rights reserved
引用
收藏
页码:3113 / 3115
页数:3
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