DEVELOPMENT AND THERMAL DURABILITY OF AN INTERFACIAL BOND BETWEEN ELECTROLESSLY DEPOSITED METALS AND A FLUORINATED POLYIMIDE

The oxygen content of a fluorinated polyimide surface can be increased by exposure to an oxidant such as an alkaline permanganate solution. Deposition of an electroless metal layer on this oxidized surface results in the formation of an interfacial bond which is predominantly chemical in nature. The level of adhesion achieved depends both on the surface oxidation conditions and post-plating heating. Adhesion maxima are obtained by heating to 200 degrees C for an electroless Cu deposit and to 300 degrees C, the cure temperature for the polyimide film, for deposited electroless Ni. The fluorinated polyimide used in this study was derived from the reaction of 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane with pyromellitic dianhydride and was obtained from Ethyl Corporation as Eymyd(R) L30N resin.